Photo: STMicroelectronics
STMicroelectronics has introduced an automotive satellite-navigation chip designed to deliver high-quality position data needed by advanced driving systems.
Joining ST’s Teseo V family, the STA8135GA automotive-qualified GNSS receiver integrates a triple-band positioning measurement engine. It also provides standard multi-band position-velocity-time (PVT) and dead reckoning.
The STA8135GA’s triple-band enables the receiver to efficiently acquire and track the largest number of satellites in multiple constellations simultaneously for superior performance in difficult conditions such as in urban canyons and under tree cover.
Triple band has historically been used in professional applications such as surveying, mapping and precision agriculture that demand millimeter accuracy with minimal reliance on correction data, usually available on larger and more expensive modules than ST’s single-chip STA8135GA.
The compact STA8135GA will help driver-assistance systems make accurate decisions about the road ahead. The multi-constellation receiver delivers raw information for the host system to run any precise-positioning algorithm, such as PPP/RTK (precise point positioning/real-time kinematic). The receiver can track satellites in the GPS, GLONASS, BeiDou, Galileo, QZSS and NAVIC/IRNSS constellations.
The STA8135GA also integrates separate low-dropout voltage regulators on chip to supply the analog circuitry, digital core and input/output transceivers, simplifying selection of the external power supply.
The STA8135GA also enhances the performance of in-dash navigation systems, telematics equipment, smart antennas, V2X communication systems, marine navigation systems, drones, and other vehicles.
“The high precision and single-chip integration delivered by the STA8135GA satellite receiver enables the creation of reliable and affordable navigation systems that enable vehicles to be safer and more context aware,” said Luca Celant, general manager, ADAS, ASIC and Audio Division, Automotive and Discrete Group, STMicroelectronics. “Our unique in-house design resources and processes for high-yield manufacturing are among the critical capabilities that have made this industry-first device possible.”
The STA8135GA is housed in a 7 x 11 x 1.2 BGA package. Samples are available now and full qualification AEC-Q100 and Start Of Production are scheduled for the first quarter of 2022.
